Study of a Failure of a Compact Ceramic No-lead Package Due to Tinning Induced Thermal Shock and Its Design Improvement

Qiaochu Guo^1,2, Yi Cui^1,2, Sijia Cao^1,2, Jinhua Zhou^1,2, Shuping Meng^1,2

¹Beijing Institute of Precision and Mechatronics and Controls; ²Laboratory of Aerospace Servo Actuation and Transmission

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun^1,3, Olivier Maire¹, Pascal Retailleau¹, Catherine Jephos², Alexandrine Guédon-Gracia³, Hélène Frémont³

¹MBDA France, France; ²DGA MI, France; ³IMS Bordeaux, France

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Łukasiewicz Research Network - ITR, Poland