The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 1C: Quality and Reliability

Time:

Tuesday, 16/Sept/2025:

11:15am - 12:30pm

Session Chair: Jean-luc Diot, ASSEMBLINNOV

Location: Mont Blanc

Presentations

A Scalable Test Methodology for High Quality AI Products Delivery

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Meta Platforms Inc., United States of America

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Łukasiewicz Research Network - ITR, Poland

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun^1,3, Olivier Maire¹, Pascal Retailleau¹, Catherine Jephos², Alexandrine Guédon-Gracia³, Hélène Frémont³

¹MBDA France, France; ²DGA MI, France; ³IMS Bordeaux, France