Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Meta Platforms Inc., United States of America

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Łukasiewicz Research Network - ITR, Poland

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun^1,3, Olivier Maire¹, Pascal Retailleau¹, Catherine Jephos², Alexandrine Guédon-Gracia³, Hélène Frémont³

¹MBDA France, France; ²DGA MI, France; ³IMS Bordeaux, France