High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet¹, Aline Meuris², Olivier Limousin², David Baudin³, Jeremy Chauveau¹, Denis Chesnais¹, Eric Tan¹, Fabrice Soufflet¹, Olivier Garel¹

¹3D PLUS, France; ²Université Paris-Saclay, Université Paris Cité, CEA, CNRS, AIM; ³IRFU, CEA, Université Paris-Saclay

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

Ontos Equipment Systems (OES), United States of America

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt¹, Mael Boland¹, Melanie Mathon¹, Battist Rabay², Adrian Stelzer², Julien Hossain²

¹Inventec Preformance Chemicals, France; ²NANO-JOIN