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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 8B: Assembly and Manufacturing

Time:

Thursday, 18/Sept/2025:

11:30am - 12:45pm

Session Chair: Craig Bishop, Deca Technologies

Location: Kilimandjaro

Presentations

High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet¹, Aline Meuris², Olivier Limousin², David Baudin³, Jeremy Chauveau¹, Denis Chesnais¹, Eric Tan¹, Fabrice Soufflet¹, Olivier Garel¹

¹3D PLUS, France; ²Université Paris-Saclay, Université Paris Cité, CEA, CNRS, AIM; ³IRFU, CEA, Université Paris-Saclay

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

Ontos Equipment Systems (OES), United States of America

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt¹, Mael Boland¹, Melanie Mathon¹, Battist Rabay², Adrian Stelzer², Christophe Dehon¹

¹Inventec Preformance Chemicals, France; ²NANO-JOIN

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda