The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 7B: IC Packaging

Time:

Thursday, 18/Sept/2025:

9:40am - 10:55am

Session Chair: Gabriel Kopp, Valeo

Location: Kilimandjaro

Presentations

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Yole Group, France

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler, Stephan Dietrich

GS Swiss PCB AG, Switzerland

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

X-FAB MEMS Foundry GmbH, Germany