The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@empc2025.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

S 7B: IC Packaging

Time:

Thursday, 18/Sept/2025:

9:40am - 10:55am

Location: Kilimandjaro

Presentations

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Yole Group, France

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler

GS Swiss PCB AG, Switzerland

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

X-FAB MEMS Foundry GmbH, Germany

Mobile View Print View

Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: EMPC 2025

Conference Software: ConfTool Pro 2.8.106
© 2001–2025 by Dr. H. Weinreich, Hamburg, Germany