Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !
M.Bilal Hachemi
Yole Group, France
Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology
Stephan Trautweiler, Stephan Dietrich
GS Swiss PCB AG, Switzerland
Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing
Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger
X-FAB MEMS Foundry GmbH, Germany
