Conference Agenda

Session
S 6A: System in Package
Time:
Wednesday, 17/Sept/2025:
4:05pm - 5:20pm

Location: Amphitheatre


Presentations

Highly Integrated Low Power Wireless Sensor Node

Luca Maggi1, Marco Del Sarto1, Amedeo Maierna1, Alex Gritti1, Claudio Porzi2, Gaspare Santaera2, Filippo Scotti2, Marc Sorel2, Cesare Stefanini2, Antonella Bogoni2, Piero Castoldi2, Marco Chiesa3, Aina Serrano Rodrigo3, Davide Rotta3

1STMicroelectronics, Italy; 2Scuola Superiore Sant'Anna, Italy; 3CamGraPhIC, Italy



Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

Univ. Grenoble Alpes, CEA, Leti



RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications

Alexander Gaebler1, Uwe Maaß1, Ivan Ndip1,2, Kai Zoschke1, Marius Adler1

1Fraunhofer IZM, Germany; 2Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany