Session | ||
S 6A: System in Package
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Presentations | ||
Highly Integrated Low Power Wireless Sensor Node 1STMicroelectronics, Italy; 2Scuola Superiore Sant'Anna, Italy; 3CamGraPhIC, Italy Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration Univ. Grenoble Alpes, CEA, Leti RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications 1Fraunhofer IZM, Germany; 2Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany |