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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

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Session Overview

Session

S 6A: System in Package

Time:

Wednesday, 17/Sept/2025:

3:50pm - 5:05pm

Session Chair: Jean-François Sauty, ASE

Location: Auditorium

Presentations

Highly Integrated Low Power Wireless Sensor Node

Luca Maggi¹, Marco Del Sarto¹, Amedeo Maierna¹, Alex Gritti¹, Claudio Porzi², Gaspare Santaera², Filippo Scotti², Marc Sorel², Cesare Stefanini², Antonella Bogoni², Piero Castoldi², Marco Chiesa³, Aina Serrano Rodrigo³, Davide Rotta³

¹STMicroelectronics, Italy; ²Scuola Superiore Sant'Anna, Italy; ³CamGraPhIC, Italy

Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

Univ. Grenoble Alpes, CEA, Leti

Investigation of RF Characteristics of Inter-Chiplet Connections for Advanced HPC Packaging Solutions

Alexander Gaebler¹, Uwe Maaß¹, Ivan Ndip^1,2, Kai Zoschke¹, Marius Adler¹

¹Fraunhofer IZM, Germany; ²Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany