Highly Integrated Low Power Wireless Sensor Node

Luca Maggi¹, Marco Del Sarto¹, Amedeo Maierna¹, Alex Gritti¹, Claudio Porzi², Gaspare Santaera², Filippo Scotti², Marc Sorel², Cesare Stefanini², Antonella Bogoni², Piero Castoldi², Marco Chiesa³, Aina Serrano Rodrigo³, Davide Rotta³

¹STMicroelectronics, Italy; ²Scuola Superiore Sant'Anna, Italy; ³CamGraPhIC, Italy

Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

Univ. Grenoble Alpes, CEA, Leti

RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications

Alexander Gaebler¹, Uwe Maaß¹, Ivan Ndip^1,2, Kai Zoschke¹, Marius Adler¹

¹Fraunhofer IZM, Germany; ²Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany