Precise Alignment and Laser-assisted Bonding of Multichannel Laser Diode Chips for Silicon Photonics Integration

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Optoelectronics Research Centre, ENS Faculty, Tampere University, Finland

Assembly Perspectives on Flip-chip Integration of 1x, 4x and 8x Array InP-SiN Hybrid Laser Devices to Si Photonics Wafers with Sub-500 nm Misalignment

Damien Leech¹, Sulakshna Kumari¹, Huseyin Sar¹, Negin Golshani¹, Dmitry Kazakov¹, Hsiao-Lun Wang¹, Francois Chancerel¹, Geert Langenus¹, Hemant Kumar Tyagi¹, Eirini Sarelli¹, Sebastian Haensch², Hanh Mai², Andreas Ehrl², Aleksandrs Marinins¹, Charles Caer¹, Yannick De Koninck¹, Stuart Smyth³, Andrew McKee³, Olek Kowalski³, Megan McLelland³, Maumita Chakrabarti¹, Dimitrios Velenis¹, Peter Verheyen¹, Alain Phommahaxay¹, Koen Kennes¹, Filippo Ferraro¹, Yoojin Ban¹, Joris van Campenhout¹

¹imec, Belgium; ²ASMPT, Germany; ³Sivers Photonics, Scotland

TSVs Mechanical Stress Measurements on Silicon Wave-guide Using Phase Shift Interferometry

Jean Charbonnier¹, Pierre Tissier², André Myko¹, Stéphane Malhouitre¹, Myriam Assous¹, Rémi Vélard¹, Stéphane Bernabé¹

¹Univ. Grenoble Alpes, CEA, Leti, Grenoble, France; ²STMicroelectronics Crolles, France

Package and Process Development of Molded Image Sensor Package

Alastair Attard

UTAC Group, Singapore