Approach for Extracting the Relative Permittivity Using a Ring Resonator Fabricated on an LTCC Substrate

Achraf Sadeddine¹, Norayr Nessimian², Camilla Karnfelt¹, Heike Bartsch², Jens Mueller², François Gallée¹

¹IMT atlantique, France; ²Technische Universität Ilmenau, Germany

Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

Claudia Feller, Henry Barth, Stefan Körner, Lars Rebenklau

Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany

Optimized Castellated Hole Interconnects for Ceramic-based Modular Millimeter-Wave Applications up to 85 GHz

Paul Perlwitz¹, Christian Tschoban¹, Uwe Krieger², Qaisar Khushi Muhammad², Harald Pötter¹, Martin Schneider-Ramelow¹

¹Fraunhofer IZM, Germany; ²VIA electronic GmbH, Germany

Glasses as substrates for packaging: Remarks on mechanic reliability.

Martin Letz¹, Fabian Wagner¹, Inge Burger¹, Rule Kirchhoff¹, Volker Seibert¹, Ulrich Peuchert²

¹SCHOTT AG, Mainz, Germany; ²SCHOTT Semicon Glass Solutions, Mainz, Germany