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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 4B: Design, Modelling and Simulation

Time:

Wednesday, 17/Sept/2025:

11:00am - 12:15pm

Session Chair: Sung-Uk Zhang, Dong-Eui University

Location: Kilimandjaro

Presentations

Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen¹, Jean-François Sauty²

¹Advanced Semiconductor Engineering, Inc., Taiwan; ²ASE Europe, France

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Dong-Eui University, Korea, Republic of (South Korea)

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas¹, Puneet Sharma¹, Roman Boldyrjew-Mast¹, Maurizio Tranchero², Sven Rzepka¹

¹Fraunhofer Institute for Electronic Nano Systems, Germany; ²Ideas & Motion s.r.l, Cherasco, Italy

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda