Conference Time: 26th July 2025, 02:54:17pm CEST
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S 4B: Design, Modelling and Simulation
Time:
Wednesday, 17/Sept/2025:
11:00am - 12:15pm
Location: Kilimandjaro
Presentations
Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach
Tang-Yuan Chen1 , Jean-François Sauty 2
1 Advanced Semiconductor Engineering, Inc., Taiwan; 2 ASE Europe, France
Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages
Na-Yeon Choi, Sung-Uk Zhang
Dong-Eui University, Korea, Republic of (South Korea)
Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs
Kshitij Anil Kolas 1 , Puneet Sharma1 , Roman Boldyrjew-Mast1 , Maurizio Tranchero2 , Sven Rzepka1
1 Fraunhofer Institute for Electronic Nano Systems, Germany; 2 Ideas & Motion s.r.l, Cherasco, Italy
