Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen

Advanced Semiconductor Engineering, Inc., Taiwan

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Dong-Eui University, Korea, Republic of (South Korea)

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas¹, Puneet Sharma¹, Roman Boldyrjew-Mast¹, Maurizio Tranchero², Sven Rzepka¹

¹Fraunhofer Institute for Electronic Nano Systems, Germany; ²Ideas & Motion s.r.l, Cherasco, Italy