Conference Agenda

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier¹, Benoit Saudet¹, David Henry¹, Christophe Licitra¹, Nicolas Gauthier¹, Paul-Henri Haumesser¹, Ky-Lim Tan², Hicham Aytous³, Jean-Michel Morel²

¹Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; ²Valeo, Créteil, France; ³Valeo, Sable sur Sarthe, France

Thermal and Structural Analysis of GaN Layers on Foreign Substrates for Vertical Power Devices

Verena Leitgeb¹, Sandra Fischer¹, Lisa Mitterhuber¹, Barbara Kosednar-Legenstein¹, Frank Brunner², Eldad Bahat-Treidel², Elke Kraker¹

¹Materials Center Leoben Forschung GmbH, Austria; ²Ferdinand-Braun-Institut, Germany

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

Heraeus Electronics GmbH & Co KG, Germany