JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@empc2025.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

S 3B: Power Electronics

Time:

Tuesday, 16/Sept/2025:

4:35pm - 5:50pm

Session Chair: Stoyan Stoyanov, University of Greenwich

Location: Kilimandjaro

Presentations

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier¹, Benoit Saudet¹, David Henry¹, Christophe Licitra¹, Nicolas Gauthier¹, Paul-Henri Haumesser¹, Ky-Lim Tan², Hicham Aytous³, Jean-Michel Morelle²

¹Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; ²Valeo, Créteil, France; ³Valeo, Sable sur Sarthe, France

Correlated Thermal and Structural Characterization of GaN on Sapphire for Vertical Power Devices: Strain, Lattice Parameters, and Phonon Scattering Analysis

Verena Leitgeb¹, Sandra Fischer¹, Lisa Mitterhuber¹, Barbara Kosednar-Legenstein¹, Frank Brunner², Eldad Bahat-Treidel², Elke Kraker¹

¹Materials Center Leoben Forschung GmbH, Austria; ²Ferdinand-Braun-Institut, Germany

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

Heraeus Electronics GmbH & Co KG, Germany

The 25th European Microelectronics &
Packaging Conference (EMPC 2025)

16 – 18 September 2025

World Trade Center, Grenoble | France

Conference Agenda