Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization
Céline Feautrier1, Benoit Saudet1, David Henry1, Christophe Licitra1, Nicolas Gauthier1, Paul-Henri Haumesser1, Ky-Lim Tan2, Hicham Aytous3, Jean-Michel Morel2
1Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; 2Valeo, Créteil, France; 3Valeo, Sable sur Sarthe, France
Correlated Thermal and Structural Characterization of GaN on Sapphire for Vertical Power Devices: Strain, Lattice Parameters, and Phonon Scattering Analysis
Verena Leitgeb1, Sandra Fischer1, Lisa Mitterhuber1, Barbara Kosednar-Legenstein1, Frank Brunner2, Eldad Bahat-Treidel2, Elke Kraker1
1Materials Center Leoben Forschung GmbH, Austria; 2Ferdinand-Braun-Institut, Germany
The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips
Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam
