Characterization of Chip-to-wafer Interconnects with Thick Gold Finish for Fan-out Wafer-level Packaging RDL First Integration

Arnaud Garnier, Laetitia Castagné, Guenaëlle Massignac, Rémi Franiatte, Daniel Mermin, Alain Gueugnot, Perceval Coudrain

Univ. Grenoble Alpes, CEA, Leti, Grenoble, France

Fine-pitch Die-to-wafer Bonding Technologies for Chiplet Integration

Juliana Panchenko^1,2, Laura Wenzel^1,2, Steffen Bickel¹, Adil Shehzad¹, Fabian Hopsch³, Sebastian Quednau⁴, Manuela Junghaehnel¹

¹All Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration IZM, Dresden, Germany; ²Institute of Electronic Packaging Technology, Technische Universität Dresden, Dresden, Germany; ³Institutsteil Entwicklung Adaptiver Systeme EAS, Fraunhofer-Institut für Integrierte Schaltungen IIS, Dresden, Germany; ⁴Nanowired GmbH, Emanuel-Merck-Straße 99, Gernsheim, Germany

Fabrication of Indium Interconnections for Flip-chip Assembly on Single Die

Mel Dehays, Sébastien Renet, Olivier Mailliart, Patrick Peray, Frédéric Berger, Guillaume Lamarache

Commissariat à l'énergie atomique (CEA), France