The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview | |
| Location: Mont Blanc 4 |
| Date: Monday, 15/Sept/2025 | |
| 9:00am - 1:00pm |
SC 1: Short Course Location: Mont Blanc 4 "Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics" Short Course Instructor: John Lau, Unimicron Technology Corporation |
| 2:00pm - 6:00pm |
SC 3: Short Course Location: Mont Blanc 4 "From Wafer to Panel Level Packaging" Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM |