Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components

David Henry, Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier

Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang Vu Nguyen, Knut Eilif Aasmundtveit

Large Area (> 2500mm²) Sintering at Sub 220°C With Micro-scale Copper Flakes

Rohan Ghosh, Olaf Rämer, Gomathi Varshini Kanthi Natarajan, Sri Krishna Bhogaraju

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-thin Chips

Tomoka Kirihata, Masanori Yamagishi, Yusuke Fumita, Ichiro Sano, Jun Kaneyasu, Shinya Takyu

Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications

Filip Granek, Piotr Kowalczewski

Plasma Influence for Polymer Uniform Spreading on Heterogeneous Surfaces

Chloé Schubert, Nohora Caicedo, Sylvain Revol, Laurence Capellaro

Thermomechanical Study for Stress-management of Silicon Photonics Interposers

Céline Feautrier, Benoit Saudet, Jean Charbonnier, Edouard Deschaseaux, Damien Saint-Patrice, Rémi Vélard, Myriam Assous

Study on the Influence of Reflow Soldering on the Reliability of Mixed Solder Joints

Xiaodong Chen, Baojun Qiu, Zengxiong Zheng, Hui Xiao, Jiang Xie, Tao Lu, Daojun Luo

Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

A Comparative Study of Silver Sintering Pastes for Die-attach Applications: Microstructure, Mechanical Properties, and Reliability

Jiri Hlina, Martin Hirman, David Michal, Martin Janda

Design and Evaluation of a Perforated Dielectric Flat Lens Antenna Array for D-band Applications

Yen Ting Wang, Po-An Lin, Huei-Shyong Cho, Shih-wen Lu, Wei-Tung Chang

A High Gain Antenna-in-Package (AiP) with Horn Structure for D-band Applications

Po-An Lin, Shao-En Hsu, Shih-Wen Lu, Yu-Chang Chen, Jen-Chieh Kao

Fine-pitch Flip-chip Bonding Process with Laser Non-conductive Paste (NCP) and Laser-assisted Bonding (LAB) for High-reliability

Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Ga-Eun Lee, Seong-Cheol Kim, Kwang-Seong Choi

Electrochemical Analysis Reveals Effective Grain Refinement in Copper Electroplating

Rui-Zhe Wu, Tzu-Hsing Chiang, Chen-Chao Wang, Chin-Pin Hung

Indium as the Superconducting Interconnect for Quantum Chiplets

Jowesh Avisheik Goundar, Mai Thi Ngoc La, Yugi Otake, Hideo Kosaka, Fumihiro Inoue

Test Equipment for Sensor Interfaces Emulated by Generic Electronic Control Unit

Nicolae Ioan Gross, Paul Svasta

Visualizing Vibrations of Electronic Modules in Test

Artem Ivanov

Grain Orientation Analysis for Thermal Cycling Evaluation of Die-attach Solder Joints

Hiroaki Tatsumi, Yujiro Hayashi, Jaemyung Kim, Makina Yabashi, Hiroshi Nishikawa

Thermal Fatigue Resistance Improvement of New Al Bonding Wire

Motoki Eto, Noritoshi Araki, Daizo Oda, Sandy Klengel, Robert Klengel, Tomohiro Uno

Thermal Analysis of Power Electronic Modules with Parametric Model Order Reduction

Sheikh Hassan, Mark Sherriff, Pearl Agyakwa, Paul Evans, Stoyan Stoyanov

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider, Aswathi Koorikkat, John D. Lipp, Marcus J. French, Narendra Acharya, Kitti Ratter, Vivek Chidambaram, Pawala Ariyathilaka

Flip-chip Bonded Hybrid Germanium X-ray Detectors Suitable for Operating with Thermal Gradient Between Sensor and ASIC

Andreas Schneider, James Hollingham, Alexander Dainty, Toby G. Brookes, John David Lipp, Matthew David Wilson, Marcus Julian French, Marcello Borri, Konrad Sutowski, Daniel Thacker, Matthew Buckland, Andrew Hill, William Helsby

Thermal Management of an Electronic Module Made by a Solderless Assembly Method

Gaudentiu Varzaru, Roxana Tulea, Madalin Moise, Mihai Branzei, Paul Svasta

Selective Micro Laser Melting: Influence of Scan Speed and Laser Power on Interconnect Morphology and Performance

Arun Kumar Sivakumar, Manish Arora

Flip Chip Bonding of PMUT Using Adhesives and their Effect on Electrical Performance

Muhammad Hassan Malik, Zhou Da, Rodrigo Tumolin Rocha, Chunlei Xu

Automated Non-destructive Mechanical Testing of Fine Pitch Wirebond Arrays

Lyle Alexander Menk

Advanced Underfill Developments Enabling Complex AI and HPC Package Designs

Ruud De Wit

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

Printable non-volatile and volatile memristors based on Lead-Free Perovskites for artificial synapses and neurons emulation

Michalis Loizos, Konstantinos Chatzimanolis, Konstantinos Rogdakis, Emmanuel Kymakis

Power modules: Crack and shrinkage phenomenon

Adeline Liger, Vincent Charlot, Jean-Christophe Leroux

Void inspection using stress field imaging in densely patterned bonded wafers

Zsolt Kovács, Csenge Dobos, Gábor Molnár, Zsolt Kovács, György Nádudvari, Zoltán Kiss

Photoresist/polymer removal optimized chemistry with adding hydrogen radical in MEMS process fabrication and other applications with HDRF®

Marc Segers, Giovanni Terenziani, Safia Benkoula

Innovative deposition solution for TSV integration and conformal deposition of oxide, nitride, and metal layer with dual frequency pulsed equipment, application of low temperature deposition of dielectric layer

Marc Segers, Pierre-David Szkutnik, Safia Benkoula

Temperature Profile Optimization for Vacuum Soldering of Components on Heat Sink

František Steiner, Martin Hirman, Pavel Rous, Václav Wirth

Investigating the Dynamic Bending Behaviour of Biodegradable Printed Circuit Boards

Oliver Krammer, Patrik Kovács, Attila Géczy

Stacked and Staggered Vias in FR4 laminate for special application

Aneta Cholaj, Krzysztof Lipiec, Andrzej Kiernich, Dariusz Ostaszewski, Miroslaw Kozlowski, Marek Koscielski, Adam Lipiec, Janusz Borecki

Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures

Karthik Vijay

Warpage Reduction of Laminate Substrates Through Metamodel-based Optimization of Material Properties

Fredy John Porathur, Fabian Huber, Eduard Stadler, Peter Filipp Fuchs, Dieter Paul Gruber

Key Technologies and Design Aspects for Advanced FOCoS Packaging

Cheng Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang, Chin-Pin Hung

Lensless Through-silicon Microscopy System for Precise Alignment in Photonic Integration Processes

Aleksandr Vlasov, Igor Shevkunov, Karen Egiazarian, Andrei Gurovich, Denis Rozhkov, Mikko Närhi, Jukka Viheriälä, Mircea Guina

Investigating the Role of Thermal Effects in RF Immunity of MEMS Microphones

Margarita Chizh, Matthias Schmidt, Sebastian Kisban, Bogdan Tanc, Yogesh Babu, Gregor Feiertag, Matthias Winter, Sushil Bharatan

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti, Reiner Maghirang, Chaimaa El Mazyani, Abderrahim Kourimy, Ismael Tahri

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar

Insulation Materials for Advanced Packaging Applications

Reki Nakano