The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview | |
| Location: Makalu |
| Date: Monday, 15/Sept/2025 | |
| 9:00am - 1:00pm |
SC 1: Short Course Location: Makalu "Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics" Short Course Instructor: John Lau, Unimicron Technology Corporation |
| 2:00pm - 6:00pm |
SC 3: Short Course Location: Makalu "From Wafer to Panel Level Packaging" Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM |
| Date: Tuesday, 16/Sept/2025 | |
| 11:15am - 12:30pm |
S 1D: Assembly and Manufacturing Location: Makalu |
| 1:50pm - 3:05pm |
S 2D: Materials Location: Makalu |
| 4:35pm - 5:50pm |
S 3D: Assembly and Manufacturing Location: Makalu |
| Date: Wednesday, 17/Sept/2025 | |
| 11:00am - 12:15pm |
S 4D: POSTER SESSION #1 Location: Makalu |
| 1:35pm - 3:15pm |
S 5D: POSTER SESSION #2 Location: Makalu |
| Date: Thursday, 18/Sept/2025 | |
| 9:40am - 10:55am |
S 7D: Inspection and Test Location: Makalu |