Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun, Olivier Maire, Pascal Retailleau, Catherine Jephos, Alexandrine Guédon-Gracia, Hélène Frémont

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications

Sheng-Chi Hsieh, Yen Ting Wang, Hong-Sheng Huang, Wen-Chun Hsiao, Po-An Lin, Chen-Chao Wang, Chih-Pin Hung

Development of a 3D Quilt Packaging Method for Implantable Applications

Chloé Bernardoni, Ahmad Shah Idil, Lewis Keeble, Timothy Constandinou

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima, Ran Liu, Yang Liu, Koji. S Nakayama, Cuantong Chen, Minoru Ueshima, Katsuaki Suganuma

Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability

Janine Conrad, Martin Schneider-Ramelow, Olaf Wittler

The Impact of Processing Conditions on Bond Reliability in Pressureless Silver Sintering

Rajrupa Paul, Francesca Vita, Corentin Seibert, Reza Soleimanzadeh, Jean-Yves Loisy, Stephan Wirths

Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products

Stefano Cacciamani, Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud

Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging

Severin Schweiger, Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange

TBM-free Plasma Etch Die Singulation

Partia Naghibi, Aidan Knab

Anti-counterfeit Semiconductor Package Using a Unique Identification Mark

Ken Takano, Tadatomo Yamada, Toshiaki Menjo, Sayaka Matsuno, Shinya Takyu, Naoki Yoshida, Iwaki Miyamoto, Tsutomu Matsumoto

Metal Oxide Reduction Using Inline Openair-plasma Process to Enhance Adhesion and Improve Durability in Electronics

Dhia Bensalem, Raphael Gehra, Shirisha Kulkarni, Yaser Hamedi, Nico Coenen, Daphne Pappas, Magnus Buske

Surface Conditioning of LTCC Substrates for Improved RF Signal Propagation

Norayr Nessimian, Achraf Sadeddine, Jens Müller, Heike Bartsch

Ag-nodule Mediated Bonding Using Liquid Quenched Ag-Si Alloy

Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma

Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes – Comparison of Data Sheet and Real Application

Antje Steller, Moritz Schwengber, Ömer Faruk Yildiz, Jörg Franke

Characterisation and Modelling of Sintered Joints Used in Power Electronics

Laurent Vivet

A Novel Photo-patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-chip Interconnections

Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Ki-Seok Jang, Chanmi Lee, Gyeongmin Park, Hyemi Lee, Hyeryeon Hwang, Ga-Eun Lee, Seong-Cheol Kim, Jaejun Lee, Kwang-Seong Choi, Yong-Sung Eom

Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication

Ran Yin, Tilo Meister, Mojtaba Sohrabi, Krzysztof Nieweglowski, Franz Alwin Dürrwald, Christian Hoyer, Frank Ellinger, Dirk Plettemeier, Karlheinz Bock

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu, Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei, Bianca Enache

Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler, Jens Müller, Ansgar Ramesohl, Kurt-Georg Besendörfer, Nicolas Heuck