Material Strategy and Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt, Adrian Goldberg, Birgit Manhica, Lynn Ratajczak, Martin Ihle

A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging

Dariush Ghaffari Tari, Arsia Khanfekr, Rong Zhang, Jeffrey Grover, Ning Liu, Kail Shim, Manuel Schiel, Matthew Tsai, Rossette Guino

Simulation-based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones

Yogesh Babu, Sebastian Kisban, Matthias Winter, Matthias Schmidt, Margarita Chizh, Gregor Feiertag

Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants

Alexander Reichel, Falk Naumann, Sandy Klengel

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier, Benoit Saudet, David Henry, Christophe Licitra, Nicolas Gauthier, Paul-Henri Haumesser, Ky-Lim Tan, Hicham Aytous, Jean-Michel Morel

Thermal and Structural Analysis of GaN Layers on Foreign Substrates for Vertical Power Devices

Verena Leitgeb, Sandra Fischer, Lisa Mitterhuber, Barbara Kosednar-Legenstein, Frank Brunner, Eldad Bahat-Treidel, Elke Kraker

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas, Puneet Sharma, Roman Boldyrjew-Mast, Maurizio Tranchero, Sven Rzepka

Precise Alignment and Laser-assisted Bonding of Multichannel Laser Diode Chips for Silicon Photonics Integration

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Assembly Perspectives on Flip-chip Integration of 1x, 4x and 8x Array InP-SiN Hybrid Laser Devices to Si Photonics Wafers with Sub-500 nm Misalignment

Damien Leech, Sulakshna Kumari, Huseyin Sar, Negin Golshani, Dmitry Kazakov, Hsiao-Lun Wang, Francois Chancerel, Geert Langenus, Hemant Kumar Tyagi, Eirini Sarelli, Sebastian Haensch, Hanh Mai, Andreas Ehrl, Aleksandrs Marinins, Charles Caer, Yannick De Koninck, Stuart Smyth, Andrew McKee, Olek Kowalski, Megan McLelland, Maumita Chakrabarti, Dimitrios Velenis, Peter Verheyen, Alain Phommahaxay, Koen Kennes, Filippo Ferraro, Yoojin Ban, Joris van Campenhout

TSVs Mechanical Stress Measurements on Silicon Wave-guide Using Phase Shift Interferometry

Jean Charbonnier, Pierre Tissier, André Myko, Stéphane Malhouitre, Myriam Assous, Rémi Vélard, Stéphane Bernabé

Package and Process Development of Molded Image Sensor Package

Alastair Attard

Advanced Defects Repair Techniques for Enhancing Yield in Packaging Architectures

Adam Ginsburg

Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumnar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe

Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu, Chuantong Chen, Yang Liu, Koji S. Nakayama, Masahiko Nishijima, Minoru Ueshima, Katsuaki Suganuma

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet, Aline Meuris, Olivier Limousin, David Baudin, Jeremy Chauveau, Denis Chesnais, Eric Tan, Fabrice Soufflet, Olivier Garel

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt, Mael Boland, Melanie Mathon, Battist Rabay, Adrian Stelzer, Julien Hossain