Material Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura, Kazue Hirano

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-Luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt, Adrian Goldberg, Birgit Manhica, Lynn Möhring, Martin Ihle

Characterization of Chip-to-wafer Interconnects with Thick Gold Finish for Fan-out Wafer-level Packaging RDL First Integration

Arnaud Garnier, Laetitia Castagné, Guenaëlle Massignac, Rémi Franiatte, Daniel Mermin, Alain Gueugnot, Perceval Coudrain

Fine-pitch Die-to-wafer Bonding Technologies for Chiplet Integration

Juliana Panchenko, Laura Wenzel, Steffen Bickel, Adil Shehzad, Fabian Hopsch, Sebastian Quednau, Manuela Junghaehnel

Fabrication of Indium Interconnections for Flip-chip Assembly on Single Die

Mel Dehays, Sébastien Renet, Olivier Mailliart, Patrick Peray, Frédéric Berger, Guillaume Lamarache

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier, Benoit Saudet, David Henry, Christophe Licitra, Nicolas Gauthier, Paul-Henri Haumesser, Ky-Lim Tan, Hicham Aytous, Jean-Michel Morel

Correlated Thermal and Structural Characterization of GaN on Sapphire for Vertical Power Devices: Strain, Lattice Parameters, and Phonon Scattering Analysis

Verena Leitgeb, Sandra Fischer, Lisa Mitterhuber, Barbara Kosednar-Legenstein, Frank Brunner, Eldad Bahat-Treidel, Elke Kraker

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen, Jean-François Sauty

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas, Puneet Sharma, Roman Boldyrjew-Mast, Maurizio Tranchero, Sven Rzepka

Precise Alignment and Laser-assisted Bonding of Multichannel Laser Diode Chips for Silicon Photonics Integration

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Assembly Perspectives on Flip-chip Integration of 1x, 4x and 8x Array InP-SiN Hybrid Laser Devices to Si Photonics Wafers with Sub-500 nm Misalignment

Damien Leech, Sulakshna Kumari, Huseyin Sar, Negin Golshani, Dmitry Kazakov, Hsiao-Lun Wang, Francois Chancerel, Geert Langenus, Hemant Kumar Tyagi, Eirini Sarelli, Sebastian Haensch, Hanh Mai, Andreas Ehrl, Aleksandrs Marinins, Charles Caer, Yannick De Koninck, Stuart Smyth, Andrew McKee, Olek Kowalski, Megan McLelland, Maumita Chakrabarti, Dimitrios Velenis, Peter Verheyen, Alain Phommahaxay, Koen Kennes, Filippo Ferraro, Yoojin Ban, Joris van Campenhout

Impact of TSV Mechanical Stress on Silicon Wave-guides Using Phase Shift Interferometry

Jean Charbonnier, Pierre Tissier, André Myko, Stéphane Malhouitre, Myriam Assous, Rémi Vélard, Stéphane Bernabé

Package and Process Development of Molded Image Sensor Package

Alastair Attard, Jeffrey David Punzalan

Advanced Techniques for Short Defect Repair to Improve Yield in Packaging Architectures

Adam Ginsburg, Dmitri Burshtyn, Nava Shpaisman

Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe, Thomas Haertling

Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu, Chuantong Chen, Yang Liu, Koji S. Nakayama, Masahiko Nishijima, Minoru Ueshima, Katsuaki Suganuma

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler, Stephan Dietrich

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet, Aline Meuris, Olivier Limousin, David Baudin, Jeremy Chauveau, Denis Chesnais, Eric Tan, Fabrice Soufflet, Olivier Garel

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt, Mael Boland, Melanie Mathon, Battist Rabay, Adrian Stelzer, Christophe Dehon