The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview | |
| Location: Kilimandjaro |
| Date: Tuesday, 16/Sept/2025 | |
| 11:15am - 12:30pm |
S 1B: Interconnection Technologies Location: Kilimandjaro Chair: Hiroshi Nishikawa, Osaka University |
| 1:50pm - 3:05pm |
S 2B: Interconnection Technologies Location: Kilimandjaro Chair: Pradeep Lall, Auburn University |
| 4:35pm - 5:50pm |
S 3B: Power Electronics Location: Kilimandjaro Chair: Stoyan Stoyanov, University of Greenwich |
| Date: Wednesday, 17/Sept/2025 | |
| 11:00am - 12:15pm |
S 4B: Design, Modelling and Simulation Location: Kilimandjaro Chair: Sung-Uk Zhang, Dong-Eui University |
| 1:35pm - 3:15pm |
S 5B: Optoelectronics Location: Kilimandjaro Chair: Romain Coffy, STMicroelectronics |
| 3:50pm - 5:05pm |
S 6B: Quality and Reliability Location: Kilimandjaro Chair: Tobias Schramm, Amkor Technology Euroservices |
| Date: Thursday, 18/Sept/2025 | |
| 9:40am - 10:55am |
S 7B: IC Packaging Location: Kilimandjaro Chair: Gabriel Kopp, Valeo |
| 11:30am - 12:45pm |
S 8B: Assembly and Manufacturing Location: Kilimandjaro Chair: Craig Bishop, Deca Technologies |