Development of Die Attach Process for Thin Device Using a Novel High Thermal Conductivity Pressure-less Semi-sintering Paste with Capillary Filling Technology

Shogo Nakano, Low Shuey Seng, Nicoletta Modarelli, Matteo Luca Quattrocchio

A Novel Package Technology for Better MOSFET Performance

Arnel Taduran, Ilyas Dchar, Ding Yandoc

Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Marc Dreissigacker, Daniel Lieske, Tanja Braun, Markus Wöhrmann

Characterization of Chip-to-wafer Interconnects with Thick Gold Finish for Fan-out Wafer-level Packaging RDL First Integration

Arnaud Garnier, Laetitia Castagné, Guenaëlle Massignac, Rémi Franiatte, Daniel Mermin, Alain Gueugnot, Perceval Coudrain

Fine-pitch Die-to-wafer Bonding Technologies for Chiplet Integration

Juliana Panchenko, Laura Wenzel, Steffen Bickel, Adil Shehzad, Fabian Hopsch, Sebastian Quednau, Manuela Junghaehnel

Fabrication of Indium Interconnections for Flip-chip Assembly on Single Die

Mel Dehays, Sébastien Renet, Olivier Mailliart, Patrick Peray, Frédéric Berger, Guillaume Lamarache

Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability

Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, Shinoj Sridharan Nair, Oliver Chyan

Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography

Patrick Schirmer, Heinrich Trischler, Stephan Prinz

Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet

Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Laurence Capellaro, Justin Catania

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein, William Kuhblank, Rita Cicconi, Dominique de Ligny, Daniel Apel, Mirko Boin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

Approach for Extracting the Relative Permittivity of Sol-gel Using a Ring Resonator Fabricated on an LTCC Substrate

Achraf Sadeddine, Norayr Nessimian, Camilla Karnfelt, Heike Bartsch, Jens Mueller

Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

Claudia Feller, Henry Barth, Stefan Körner, Lars Rebenklau

Optimized Castellated Hole Interconnects for Ceramic-based Modular Millimeter-Wave Applications up to 85 GHz

Paul Perlwitz, Christian Tschoban, Uwe Krieger, Qaisar Khushi Muhammad, Harald Pötter, Martin Schneider-Ramelow

Glasses as substrates for packaging: Remarks on mechanic reliability.

Martin Letz, Fabian Wagner, Inge Burger, Rule Kirchhoff, Volker Seibert, Ulrich Peuchert

Highly Integrated Low Power Wireless Sensor Node

Luca Maggi, Marco Del Sarto, Amedeo Maierna, Alex Gritti, Claudio Porzi, Gaspare Santaera, Filippo Scotti, Marc Sorel, Cesare Stefanini, Antonella Bogoni, Piero Castoldi, Marco Chiesa, Aina Serrano Rodrigo, Davide Rotta

Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications

Alexander Gaebler, Uwe Maaß, Ivan Ndip, Kai Zoschke, Marius Adler

Process Development for Cu Metallization on SiC MOSFETs with Inkjet Printing Technology

Xiaojie Tian, Golzar Alavi, Bernhard Polzinger, André Zimmermann

Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process

Battist Rábay, Adrian Stelzer, Julien Hossain

Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components

Martin Schwentenwein, Josef Schlacher, Serkan Nohut, Sebastian Geier, Raul Bermejo

Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima, Ran Liu, Yang Liu, Koji. S Nakayama, Cuantong Chen, Minoru Ueshima, Katsuaki Suganuma

SACN doped solder balls alloys aging impact on BGA's reliability performance

Edwin Wakem Tangui, Laurence Capellaro, Nohora Caicedo