Process Development for Cu Metallization on SiC MOSFETs with Inkjet Printing Technology

Xiaojie Tian, Golzar Alavi, Bernhard Polzinger, André Zimmermann

Development of a Novel Pure-ag-sintering Paste for a Jet-dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-less Sintering Process

Battist Rábay, Adrian Stelzer, Julien Hossain

Additive Manufacturing of High-Performance Ceramics for Fabricating Single- and Multi-Material Components

Martin Schwentenwein, Josef Schlacher, Serkan Nohut, Sebastian Geier, Raul Bermejo

"Advanced Packaging" — A must for the Next-Gen AI and HPC Hardware ! And not Only !

M.Bilal Hachemi

Advancing IC Substrate Manufacturing: Overcoming Challenges and Exploring Opportunities with 10µm Line/Space Technology

Stephan Trautweiler

Heterogeneous Integration and Wafer-level Packaging by Micro-transfer-printing

Sebastian Wicht, Sandra Gozdzik, Kavana Mandya Sreenivasa Setty, Tino Jäger

A Novel Photo-patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-chip Interconnections

Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Ki-Seok Jang, Chanmi Lee, Gyeongmin Park, Hyemi Lee, Hyeryeon Hwang, Ga-Eun Lee, Seong-Cheol Kim, Jaejun Lee, Kwang-Seong Choi, Yong-Sung Eom

Femtosecond Laser Drilling Technologies for Through Glass Via (TGV) Fabrication in Customised Glass Interposers

Dimitris Karnakis

Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication

Ran Yin, Tilo Meister, Mojtaba Sohrabi, Krzysztof Nieweglowski, Franz Alwin Dürrwald, Christian Hoyer, Frank Ellinger, Dirk Plettemeier, Karlheinz Bock

Key Technologies and Design Aspects for Advanced FOCoS Packaging

Cheng Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang, Chin-Pin Hung

Lensless Through-silicon Microscopy System for Precise Alignment in Photonic Integration Processes

Aleksandr Vlasov, Igor Shevkunov, Karen Egiazarian, Andrei Gurovich, Denis Rozhkov, Mikko Närhi, Jukka Viheriälä, Mircea Guina

Investigating the Role of Thermal Effects in RF Immunity of MEMS Microphones

Margarita Chizh, Matthias Schmidt, Sebastian Kisban, Bogdan Tanc, Yogesh Babu, Gregor Feiertag, Matthias Winter, Sushil Bharatan

Defining a Scalable Test Methodology to Deliver High Quality AI Products

Soumya Padmanabha, Gautam Nayak, Zhenxuan Zhang

Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy

Masahiko Nishijima, Ran Liu, Yang Liu, Koji. S Nakayama, Cuantong Chen, Minoru Ueshima, Katsuaki Suganuma

SACN doped solder balls alloys aging impact on BGA's reliability performance

Edwin Wakem Tangui, Laurence Capellaro, Nohora Caicedo

High density 3D interconnections for high performance CdTe based X-rays detectors

Jean-Michel Guinet, Aline Meuris, Olivier Limousin, David Baudin, Jeremy Chauveau, Denis Chesnais, Eric Tan, Fabrice Soufflet, Olivier Garel

Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding

Daniel Pascual

A single step process for Die-attach and substrate-attach with pressure assisted sintering to face harsh conditions

Anne-Marie Laügt, Mael Boland, Melanie Mathon, Battist Rabay, Adrian Stelzer, Julien Hossain

Measurements at High Temperature for Thermal Resistance of MOSFETs

Corina Ruxandra Mitulescu, Norocel Codreanu, Ciprian Ionescu, Paul Svasta, Mihai Branzei

Influence of Uneven Chip Solder Layer Thickness on the Reliability of Power Modules

Aylin Aksoy, Florian Wagner, Marcel Sippel

Reliability Evaluation of Direct Bonding for SiC Power Devices by Power Cycling Test

Marius Köhler, Jens Müller, Ansgar Ramesohl, Kurt-Georg Besendörfer, Nicolas Heuck

Understanding Solder Creepage in Thin Si Devices Through Advanced Traceability Systems

Andrea Albertinetti, Reiner Maghirang, Chaimaa El Mazyani, Abderrahim Kourimy, Ismael Tahri

Enhancing the Reliability of Harsh Environment Electronics Through PFAS-free Multilayer ALD + Parylene Coatings

Rakesh Kumar

Insulation Materials for Advanced Packaging Applications

Reki Nakano