The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Thursday, 18/Sept/2025 | ||||
| 8:45am - 9:30am |
Keynote 6 Location: Auditorium "Advanced Packaging – The Key Technology for Chiplet Integration" by Prof. Dr.-Ing. Ulrike Ganesh (Managing Director, Fraunhofer IZM) |
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| 9:30am - 9:40am |
Room Change |
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| 9:40am - 10:55am |
S 7A: Smart Manufacturing Location: Auditorium |
S 7B: IC Packaging Location: Kilimandjaro |
S 7C: Interconnection Technologies Location: Mont Blanc |
S 7D: Inspection and Test Location: Makalu |
| 10:55am - 11:30am |
Break – Exhibition |
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| 11:30am - 12:45pm |
S 8A: Materials Location: Auditorium |
S 8B: Assembly and Manufacturing Location: Kilimandjaro |
S 8C: Power Electronics Location: Mont Blanc |
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| 12:45pm - 2:00pm |
Lunch – Exhibition |
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| 2:00pm - 2:45pm |
Keynote 7 Location: Auditorium "Charting a Path for the Chiplet Era and Beyond" by Craig Bishop (Chief Technology Officer, Deca Technologies) |
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| 2:45pm - 3:15pm |
Awards and Closing Location: Auditorium |
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| 3:30pm - 5:30pm |
Workshop: Pre-Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging hosted by the European Association on Smart Systems Integration (EPOSS) |
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