In-situ Plasma Monitoring Study for Wire Bonding Process Improvements

Nohora Caicedo, Patricia Folio, Valentin Ray, Laurence Capellaro, Justin Catania

Impact and Control of Residual Stress in Ceramic Packages

Markus Eberstein, William Kuhblank, Rita Cicconi, Dominique de Ligny, Daniel Apel, Mirko Boin

Wafer dicing technique for close-butted assemblies

Sarah Renault, Aurélia Plihon, Emerick Lorent, Myriam Tournaire, Nicolas Bresson, Delphine Rolland

Intelligent Prediction of Warpage in Molded fcBGA Packages: An Optimization and Modeling Approach

Tang-Yuan Chen

Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages

Na-Yeon Choi, Sung-Uk Zhang

Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs

Kshitij Anil Kolas, Puneet Sharma, Roman Boldyrjew-Mast, Maurizio Tranchero, Sven Rzepka

Impact of PFAS Removal on the Harsh Environment Reliability of Semiconductor Packaging

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan

FC-LGA for Power Devices: Peculiarities and Challenges Compared with Digital Products

Stefano Cacciamani, Cristina Somma, Fabrice De Moro, Laurent Figuiere, Lou Roulon, Jerome Lopez, Ludovic Fourneaud

Modular Integration of Sensor-Chiplets using Rapid Prototyping including Interconnects and Protective Waveguide Packaging

Severin Schweiger, Harshitha Karnam, Sören Köble, Matthias Wambold, Nicolas Lange

Thermomechanical Study for Stress-management of Silicon Photonics Interposers

Céline Feautrier, Benoit Saudet, Jean Charbonnier, Edouard Deschaseaux, Damien Saint-Patrice, Rémi Vélard, Myriam Assous

Study on the Influence of Reflow Soldering on the Reliability of Mixed Solder Joints

Xiaodong Chen, Baojun Qiu, Zengxiong Zheng, Hui Xiao, Jiang Xie, Tao Lu, Daojun Luo

Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

A Comparative Study of Silver Sintering Pastes for Die-attach Applications: Microstructure, Mechanical Properties, and Reliability

Jiri Hlina, Martin Hirman, David Michal, Martin Janda

Design and Evaluation of a Perforated Dielectric Flat Lens Antenna Array for D-band Applications

Yen Ting Wang, Po-An Lin, Huei-Shyong Cho, Shih-wen Lu, Wei-Tung Chang

A High Gain Antenna-in-Package (AiP) with Horn Structure for D-band Applications

Po-An Lin, Shao-En Hsu, Shih-Wen Lu, Yu-Chang Chen, Jen-Chieh Kao

Fine-pitch Flip-chip Bonding Process with Laser Non-conductive Paste (NCP) and Laser-assisted Bonding (LAB) for High-reliability

Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Ga-Eun Lee, Seong-Cheol Kim, Kwang-Seong Choi

Electrochemical Analysis Reveals Effective Grain Refinement in Copper Electroplating

Rui-Zhe Wu, Tzu-Hsing Chiang, Chen-Chao Wang, Chin-Pin Hung

Indium as the Superconducting Interconnect for Quantum Chiplets

Jowesh Avisheik Goundar, Mai Thi Ngoc La, Yugi Otake, Hideo Kosaka, Fumihiro Inoue

Test Equipment for Sensor Interfaces Emulated by Generic Electronic Control Unit

Nicolae Ioan Gross, Paul Svasta

Visualizing Vibrations of Electronic Modules in Test

Artem Ivanov

Grain Orientation Analysis for Thermal Cycling Evaluation of Die-attach Solder Joints

Hiroaki Tatsumi, Yujiro Hayashi, Jaemyung Kim, Makina Yabashi, Hiroshi Nishikawa

Thermal Fatigue Resistance Improvement of New Al Bonding Wire

Motoki Eto, Noritoshi Araki, Daizo Oda, Sandy Klengel, Robert Klengel, Tomohiro Uno

Thermal Analysis of Power Electronic Modules with Parametric Model Order Reduction

Sheikh Hassan, Mark Sherriff, Pearl Agyakwa, Paul Evans, Stoyan Stoyanov

Approach for Extracting the Relative Permittivity of Sol-gel Using a Ring Resonator Fabricated on an LTCC Substrate

Achraf Sadeddine, Norayr Nessimian, Camilla Karnfelt, Heike Bartsch, Jens Mueller

Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

Claudia Feller, Henry Barth, Stefan Körner, Lars Rebenklau

Optimized Castellated Hole Interconnects for Ceramic-based Modular Millimeter-Wave Applications up to 85 GHz

Paul Perlwitz, Christian Tschoban, Uwe Krieger, Qaisar Khushi Muhammad, Harald Pötter, Martin Schneider-Ramelow

Glasses as substrates for packaging: Remarks on mechanic reliability.

Martin Letz, Fabian Wagner, Inge Burger, Rule Kirchhoff, Volker Seibert, Ulrich Peuchert

Precise Alignment and Laser-assisted Bonding of Multichannel Laser Diode Chips for Silicon Photonics Integration

Aleksandr Vlasov, Joel Salmi, Heidi Tuorila, Santeri Lehtinen, Jukka Viheriälä, Mircea Guina

Assembly Perspectives on Flip-chip Integration of 1x, 4x and 8x Array InP-SiN Hybrid Laser Devices to Si Photonics Wafers with Sub-500 nm Misalignment

Damien Leech, Sulakshna Kumari, Huseyin Sar, Negin Golshani, Dmitry Kazakov, Hsiao-Lun Wang, Francois Chancerel, Geert Langenus, Hemant Kumar Tyagi, Eirini Sarelli, Sebastian Haensch, Hanh Mai, Andreas Ehrl, Aleksandrs Marinins, Charles Caer, Yannick De Koninck, Stuart Smyth, Andrew McKee, Olek Kowalski, Megan McLelland, Maumita Chakrabarti, Dimitrios Velenis, Peter Verheyen, Alain Phommahaxay, Koen Kennes, Filippo Ferraro, Yoojin Ban, Joris van Campenhout

TSVs Mechanical Stress Measurements on Silicon Wave-guide Using Phase Shift Interferometry

Jean Charbonnier, Pierre Tissier, André Myko, Stéphane Malhouitre, Myriam Assous, Rémi Vélard, Stéphane Bernabé

Package and Process Development of Molded Image Sensor Package

Alastair Attard

TBM-free Plasma Etch Die Singulation

Partia Naghibi, Aidan Knab

Anti-counterfeit Semiconductor Package Using a Unique Identification Mark

Ken Takano, Tadatomo Yamada, Toshiaki Menjo, Sayaka Matsuno, Shinya Takyu, Naoki Yoshida, Iwaki Miyamoto, Tsutomu Matsumoto

Metal Oxide Reduction Using Inline Openair-plasma Process to Enhance Adhesion and Improve Durability in Electronics

Shirisha Kulkarni, Yaser Hamedi, Nico Coenen, Daphne Pappas, Dhia Bensalem

Surface Conditioning of LTCC Substrates for Improved RF Signal Propagation

Norayr Nessimian, Achraf Sadeddine, Jens Müller, Heike Bartsch

Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding

Andreas Schneider, Aswathi Koorikkat, John D. Lipp, Marcus J. French, Narendra Acharya, Kitti Ratter, Vivek Chidambaram, Pawala Ariyathilaka

Flip-chip Bonded Hybrid Germanium X-ray Detectors Suitable for Operating with Thermal Gradient Between Sensor and ASIC

Andreas Schneider, James Hollingham, Alexander Dainty, Toby G. Brookes, John David Lipp, Matthew David Wilson, Marcus Julian French, Marcello Borri, Konrad Sutowski, Daniel Thacker, Matthew Buckland, Andrew Hill, William Helsby

Thermal Management of an Electronic Module Made by a Solderless Assembly Method

Gaudentiu Varzaru, Roxana Tulea, Madalin Moise, Mihai Branzei, Paul Svasta

Selective Micro Laser Melting: Influence of Scan Speed and Laser Power on Interconnect Morphology and Performance

Arun Kumar Sivakumar, Manish Arora

Flip Chip Bonding of PMUT Using Adhesives and their Effect on Electrical Performance

Muhammad Hassan Malik, Zhou Da, Rodrigo Tumolin Rocha, Chunlei Xu

Automated Non-destructive Mechanical Testing of Fine Pitch Wirebond Arrays

Lyle Alexander Menk

Advanced Underfill Developments Enabling Complex AI and HPC Package Designs

Ruud De Wit

Advanced Dielectric Films for Fusion Bonded 3D Integration

Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata, Fumihiro Inoue

Printable non-volatile and volatile memristors based on Lead-Free Perovskites for artificial synapses and neurons emulation

Michalis Loizos, Konstantinos Chatzimanolis, Konstantinos Rogdakis, Emmanuel Kymakis

Power modules: Crack and shrinkage phenomenon

Adeline Liger, Vincent Charlot, Jean-Christophe Leroux

Void inspection using stress field imaging in densely patterned bonded wafers

Zsolt Kovács, Csenge Dobos, Gábor Molnár, Zsolt Kovács, György Nádudvari, Zoltán Kiss

Photoresist/polymer removal optimized chemistry with adding hydrogen radical in MEMS process fabrication and other applications with HDRF®

Marc Segers, Giovanni Terenziani, Safia Benkoula

Innovative deposition solution for TSV integration and conformal deposition of oxide, nitride, and metal layer with dual frequency pulsed equipment, application of low temperature deposition of dielectric layer

Marc Segers, Pierre-David Szkutnik, Safia Benkoula

Temperature Profile Optimization for Vacuum Soldering of Components on Heat Sink

František Steiner, Martin Hirman, Pavel Rous, Václav Wirth

Investigating the Dynamic Bending Behaviour of Biodegradable Printed Circuit Boards

Oliver Krammer, Patrik Kovács, Attila Géczy

Stacked and Staggered Vias in FR4 laminate for special application

Aneta Cholaj, Krzysztof Lipiec, Andrzej Kiernich, Dariusz Ostaszewski, Miroslaw Kozlowski, Marek Koscielski, Adam Lipiec, Janusz Borecki

Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures

Karthik Vijay

Warpage Reduction of Laminate Substrates Through Metamodel-based Optimization of Material Properties

Fredy John Porathur, Fabian Huber, Eduard Stadler, Peter Filipp Fuchs, Dieter Paul Gruber

Highly Integrated Low Power Wireless Sensor Node

Luca Maggi, Marco Del Sarto, Amedeo Maierna, Alex Gritti, Claudio Porzi, Gaspare Santaera, Filippo Scotti, Marc Sorel, Cesare Stefanini, Antonella Bogoni, Piero Castoldi, Marco Chiesa, Aina Serrano Rodrigo, Davide Rotta

Advancing Fan-Out Wafer-Level Packaging for III-V/CMOS Optoelectronic Transceiver SiP Integration

Perceval Coudrain, Laetitia Castagné, Arnaud Garnier, Raphaël Eleouet, Emmeline Tomas, Rémi Franiatte, Rémi Vélard, Nadia Miloud-Ali, Thierry Mourier

RF Characterization of Microscale Transmission Lines on Polymer-based Silicon Interposers for HPC Applications

Alexander Gaebler, Uwe Maaß, Ivan Ndip, Kai Zoschke, Marius Adler

Advanced Defects Repair Techniques for Enhancing Yield in Packaging Architectures

Adam Ginsburg

Prognostics and Health Monitoring: Case Study of a Light Rail Vehicle Power Converter Assembly

Darshankumnar Bhat, Stefan Muench, Mathias Kaeso, Mike Roellig, Constanze Tschoepe

Optimizing Ag Paste Thickness for Reliable Power Module Packaging

Ran Liu, Chuantong Chen, Yang Liu, Koji S. Nakayama, Masahiko Nishijima, Minoru Ueshima, Katsuaki Suganuma

Ag-nodule Mediated Bonding Using Liquid Quenched Ag-Si Alloy

Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma

Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes – Comparison of Data Sheet and Real Application

Antje Steller, Moritz Schwengber, Ömer Faruk Yildiz, Jörg Franke

Characterisation and Modelling of Sintered Joints Used in Power Electronics

Laurent Vivet