The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Wednesday, 17/Sept/2025 | ||||
| 8:45am - 9:30am |
Keynote 4 Location: Auditorium "Recent Trends in Automotive Power Module Designs and Technology for Traction Inverters" by Dr. Uwe Hansen (VP Power Component Development, Bosch) |
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| 9:30am - 10:15am |
Keynote 5 Location: Auditorium "System Technology Co-optimization for Advanced 3D & Heterogeneous Integration" by Sébastien Dauvé (CEO, CEA-Leti) |
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| 10:15am - 11:00am |
Break – Posters – Exhibition |
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| 11:00am - 12:15pm |
S 4A: Assembly and Manufacturing Location: Auditorium |
S 4B: Design, Modelling and Simulation Location: Kilimandjaro |
S 4C: IC Packaging Location: Mont Blanc |
S 4D: POSTER SESSION #1 Location: Makalu |
| 12:15pm - 1:35pm |
Lunch Break – Posters – Exhibition |
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| 1:35pm - 3:15pm |
S 5A: Substrate Technologies Location: Auditorium |
S 5B: Optoelectronics Location: Kilimandjaro |
S 5C: Emerging Technologies Location: Mont Blanc |
S 5D: POSTER SESSION #2 Location: Makalu |
| 3:15pm - 3:50pm |
Break – Posters – Exhibition |
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| 3:50pm - 5:05pm |
S 6A: System in Package Location: Auditorium |
S 6B: Quality and Reliability Location: Kilimandjaro |
S 6C: Materials Location: Mont Blanc |
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| 5:30pm - 6:00pm |
Bus transfer: Busses leaving venue for confernce dinner |
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| 7:00pm - 10:00pm |
Conference Dinner |
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