Development of Die Attach Process for Thin Device Using a Novel High Thermal Conductivity Pressure-less Semi-sintering Paste with Capillary Filling Technology

Shogo Nakano, Low Shuey Seng, Nicoletta Modarelli, Matteo Luca Quattrocchio

A Novel Package Technology for Better MOSFET Performance

Arnel Taduran, Ilyas Dchar, Ding Yandoc

Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Marc Dreissigacker, Daniel Lieske, Tanja Braun, Markus Wöhrmann

Material Strategy and Challenges for Fine Interconnection in Advanced Packages

Kazuyuki Mitsukura

Stability of the Superconducting β-Sn Phase at Low Temperatures for 3D Cryogenic Packaging

Meriem Guergour, Feautrier Céline, Patrice Gergaud, Nicolas Vaxelaire, Guillaume Freychet, Maria-luisa Calvo-Munoz, Pierre-Emile Philip, Edouard Deschaseaux, Candice Thomas, Jean Charbonnier

Integration of Photo-imaging Technology and Microvias in LTCC for Enhanced High-frequency Applications and Packaging

Kathrin Reinhardt, Adrian Goldberg, Birgit Manhica, Lynn Ratajczak, Martin Ihle

Study of a Failure of a Compact Ceramic No-lead Package Due to Tinning Induced Thermal Shock and Its Design Improvement

Qiaochu Guo, Yi Cui, Sijia Cao, Jinhua Zhou, Shuping Meng

Assessment of QFN Assemblies’ Thermal Strain Characterization and its Evolution Through Thermal Cycling Aging

Vincent Sisomseun, Olivier Maire, Pascal Retailleau, Catherine Jephos, Alexandrine Guédon-Gracia, Hélène Frémont

Embedding of components as an effective way to achieve high reliability for special applications products

Marek Koscielski, Wojciech Steplewski, Anna Sitek, Dorota Liszewska, Adam Lipiec, Janusz Borecki

Development of Advanced Screen-printing Technology for Flip-chip Transfer of Electronic Components

David Henry, Daniel Mermin, Rémi Franiatte, Delphine Rolland, Catherine Brunet-Manquat, Thierry Flahaut, Damien Saint-patrice, Bruno Fain, Hélène Lhermet, Jean-Claude Bastien, François Blard, Emmanuel Ollier

Thinning and Dicing Process Integration of High Accuracy Using A Novel Self-assembly Stage for Chip on Wafer

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu

A Study of 355 nm UV Laser Ablation Process for Singulation of Silicon Wafers

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

Characterization of Chip-to-wafer Interconnects with Thick Gold Finish for Fan-out Wafer-level Packaging RDL First Integration

Arnaud Garnier, Laetitia Castagné, Guenaëlle Massignac, Rémi Franiatte, Daniel Mermin, Alain Gueugnot, Perceval Coudrain

Fine-pitch Die-to-wafer Bonding Technologies for Chiplet Integration

Juliana Panchenko, Laura Wenzel, Steffen Bickel, Adil Shehzad, Fabian Hopsch, Sebastian Quednau, Manuela Junghaehnel

Fabrication of Indium Interconnections for Flip-chip Assembly on Single Die

Mel Dehays, Sébastien Renet, Olivier Mailliart, Patrick Peray, Frédéric Berger, Guillaume Lamarache

A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging

Dariush Ghaffari Tari, Arsia Khanfekr, Rong Zhang, Jeffrey Grover, Ning Liu, Kail Shim, Manuel Schiel, Matthew Tsai, Rossette Guino

Simulation-based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones

Yogesh Babu, Sebastian Kisban, Matthias Winter, Matthias Schmidt, Margarita Chizh, Gregor Feiertag

Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants

Alexander Reichel, Falk Naumann, Sandy Klengel

Research on Damage Behaviour of Vertical Interconnection Solder Joints in a RF SiP Module

Hui Xiao, Baojun Qiu, Jiahao Liu, Tao Lu, Xiaodong Chen, Daojun Luo

A Miniaturized Dual Band (28/39 GHz) AiP Design for Millimeter-Wave 5G Mobile Phone Applications

Sheng-Chi Hsieh

Development of a 3D Quilt Packaging Method for Implantable Applications

Chloé Bernardoni, Ahmad Shah Idil, Lewis Keeble, Timothy Constandinou

Bi–in Segregation in Low-temperature SLID Bonding: Au-in-bi System

Gayathry Thampi, Hoang Vu Nguyen, Knut Eilif Aasmundtveit

Large Area (> 2500mm²) Sintering at Sub 220°C With Micro-scale Copper Flakes

Rohan Ghosh, Olaf Rämer, Gomathi Varshini Kanthi Natarajan, Sri Krishna Bhogaraju

Influence of Total Encapsulation of White-light Mid-power LED Packages Over the Correlated Colour Temperature

Edward André Olivera Apaza, Matthias Hien, Mahmoud Beker, Markus Zankl

Exploration of Cu Interfacial Engineering to Enhance Cu Interconnects Reliability

Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, Shyam Muralidharan Nair, Khanh Tran, Shinoj Sridharan Nair, Oliver Chyan

Tailored Polymers for Wafer-level Optics Manufacturing via Nanoimprint Lithography

Patrick Schirmer, Heinrich Trischler, Stephan Prinz

Evaluations of Transient Liquid Phase Joints Using In-coated Ag Sheet

Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization

Céline Feautrier, Benoit Saudet, David Henry, Christophe Licitra, Nicolas Gauthier, Paul-Henri Haumesser, Ky-Lim Tan, Hicham Aytous, Jean-Michel Morel

Thermal and Structural Analysis of GaN Layers on Foreign Substrates for Vertical Power Devices

Verena Leitgeb, Sandra Fischer, Lisa Mitterhuber, Barbara Kosednar-Legenstein, Frank Brunner, Eldad Bahat-Treidel, Elke Kraker

The next generation die top system (Ag-only DTS®) for Cu wire bonding on SiC chips

Thorsten Vehoff, Jürgen Scharf, Benjamin Fabian, Steffen Kötter, Vemal Raja Manikam

The Effect of Solder Die Attach Voids on the Junction-to-case Thermal Resistance of MOSFET Packages

Tao Lu, Baojun Qiu, Xiaodong Chen, Hui Xiao, Daojun Luo

Experimental and Numerical Investigation of the Impact of Surface Roughness of Copper Plated through Holes on Thermomechanical Reliability

Janine Conrad, Martin Schneider-Ramelow, Olaf Wittler

The Impact of Processing Conditions on Bond Reliability in Pressureless Silver Sintering

Rajrupa Paul, Francesca Vita, Corentin Seibert, Reza Soleimanzadeh, Jean-Yves Loisy, Stephan Wirths

A New Carrier Tape for Direct Transfer Bonding (DTB) Process with Ultra-thin Chips

Tomoka Kirihata, Masanori Yamagishi, Yusuke Fumita, Ichiro Sano, Jun Kaneyasu, Shinya Takyu

Ultra-precise Dispensing for High-resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications

Filip Granek, Piotr Kowalczewski

Plasma Influence for Polymer Uniform Spreading on Heterogeneous Surfaces

Chloé Schubert, Nohora Caicedo, Sylvain Revol, Laurence Capellaro