Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Tuesday, 16/Sept/2025
9:00am
-
9:10am
Welcome & Conference Opening
9:10am
-
9:55am
Keynote 1
Location: Amphitheatre

"Propelling AI forward through Advanced Packaging Creativity"
by Ingu Yin Chang (Executive Vice President, ASE Inc.)

9:55am
-
10:40am
Keynote 2
Location: Amphitheatre

"The Interconnect 'Panelization'"
by Laurent Herard (Group VP – Head of Back End Manufacturing & Technology R&D, STMicroelectronics)

10:40am
-
11:15am
Break – Exhibition
11:15am
-
12:30pm
S 1A: IC Packaging
Location: Amphitheatre
S 1B: Intreconnection Technologies
Location: Kilimandjaro
S 1C: Quality and Reliability
Location: Mont Blanc
S 1D: Assembly and Manufacturing
Location: Makalu
12:30pm
-
1:50pm
Lunch – Exhibition
1:50pm
-
3:05pm
S 2A: Interconnection Technologies
Location: Amphitheatre
S 2B: Design, Modelling and Simulation
Location: Kilimandjaro
S 2C: System in Package
Location: Mont Blanc
S 2D: Materials
Location: Makalu
3:05pm
-
3:40pm
Break – Exhibition
3:40pm
-
4:25pm
Keynote 3
Location: Amphitheatre

"Mass Transfer: How the Push for MicroLED Displays Opens New Paths to Heterogeneous Integration"
by Dr. Chris Bower (CTO and co-founder, X Display Company (XDC)., Inc.)

4:25pm
-
4:35pm
Room Change
4:35pm
-
5:50pm
S 3A: Materials
Location: Amphitheatre
S 3B: Power Electronics
Location: Kilimandjaro
S 3C: Qulaity and Reliability
Location: Mont Blanc
S 3D: Assembly and Manufactuirng
Location: Makalu
6:00pm
-
7:30pm
Dinner: Tasting of regional products & Exhibitors' time (TBC)

 
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