The 25th European Microelectronics &
Packaging Conference (EMPC 2025)
16 – 18 September 2025
World Trade Center, Grenoble | France
Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 15/Sept/2025 | |||
| 8:30am - 6:00pm |
Pre-Registration |
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| 9:00am - 1:00pm |
SC 1: Short Course Location: Makalu "Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics" Short Course Instructor: John Lau, Unimicron Technology Corporation |
SC 2: Short Course Location: Kilimandjaro "Microelectronics Packaging Basics in Practice!" Short Course Instructor: Valérie Volant, STMicroelectronics |
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| 2:00pm - 6:00pm |
SC 3: Short Course Location: Makalu "From Wafer to Panel Level Packaging" Short Course Instructors: Tanja Braun & Markus Wöhrmann, Fraunhofer IZM |
SC 4: Short Course Location: Kilimandjaro "Electronic/Photonic Convergence Using Advanced Packaging: A Status" Short Course Instructor: Stéphane Bernabé, CEA LETI |
SC 5: Short Course Location: Mont Blanc "Fundamentals and Advanced Packaging Applications of Substrates and Interposers" Short Course Instructors: Ivan Ndip (Fraunhofer IZM) & Habib Hichri (Ajinomoto Fine-Techno USA Corporation) |
| 5:00pm - 6:00pm |
IEEE EPS Distinguished Lecture Location: Auditorium "Recent Advances and Trends in Packaging" Lecturer: John Lau, Unimicron Technology Corporation |
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| 5:30pm - 7:00pm |
Cocktail Reception for Exhibitors Location: Exhibition Area |
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