Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

List View Authors More... Page View for Export View to Embed Page in iFrame Print View Save Page to Disk

Session Overview

Date: Monday, 11/Sept/2023
8:30am - 6:00pm	Pre-Registration
9:00am - 1:00pm	SC 1: Evolution of Die Attach Adhesives & Encapsulants used in Semi-Conductor Packaging Location: Green Room Course instructor: Tony Winster, Henkel Ltd. more info	SC 2: Fan-out, Chiplet Design, and Heterogeneous Integration Packaging Location: Library Course instructor: John H. Lau, Unimicron Technology Corporation more info
1:30pm - 5:30pm	SC 3: Power Electronics Packaging – Understanding the Packaging Processes Location: Green Room Course instructor: Andy Longford, PandA Europe more info	SC 4: From Wafer to Panel Level Packaging Location: Library Course instructors: Tanja Braun, Fraunhofer IZM | Markus Wöhrmann, Fraunhofer IZM more info
6:00pm - 7:30pm	Welcome Reception at Homerton College

Date: Tuesday, 12/Sept/2023
8:30am - 9:00am	Registration/Exhibition
8:55am - 9:10am	Welcome & Conference Opening Chair: Anne Vanhoestenberghe, King's College London
9:10am - 9:40am	Keynote 1: Interconnecting Chiplets Chris Scanlan, Senior Vice President Technology, BESI Switzerland
9:45am - 10:45am	S 1A: Substrates: LTCC and HTCC Location: Main Conference Room Chair: Peter Barnwell, IMAPS-UK Trustee	S 1B: Embedding Location: Rosalind Franklin Pavilion Chair: Viorel Nicolau, "Dunarea de Jos" University of Galati
10:45am - 11:15am	Break - Exhibition
11:15am - 12:35pm	S 2A: Interconnect Materials I Location: Main Conference Room Chair: Rolf Aschenbrenner, Fraunhofer IZM	S 2B: MEMS/Sensors Location: Rosalind Franklin Pavilion Chair: Andrew Holland, RF Module And Optical Design Limited
12:35pm - 1:40pm	Lunch - Exhibition
1:40pm - 2:10pm	Keynote 2: Wide Bandgap Devices and Multi-dimensional Architectures in the New Era of Power Electronics Professor Florin Udrea, Cambridge GaN Devices
2:15pm - 3:15pm	S 3A: Substrates – Thick Film and Cu Interconnects Location: Main Conference Room Chair: Jens Müller, Technische Universität Ilmenau	S 3B: Adhesives and Encapsulants Location: Rosalind Franklin Pavilion Chair: Eamonn Redmond, Inseto (UK) Ltd
3:15pm - 3:45pm	Break - Exhibition
3:45pm - 5:05pm	S 4A: Interconnect Material II Location: Main Conference Room Chair: Olivér Krammer, Budapest University of Technology and Economics	S 4B: Medical Location: Rosalind Franklin Pavilion Chair: Anne Vanhoestenberghe, King's College London
5:10pm - 7:00pm	P: Exhibition, Poster, Pizza

Date: Wednesday, 13/Sept/2023
8:30am - 9:00am	Exhibition
9:00am - 9:10am	Welcome: Day 2
9:10am - 9:40am	Keynote 3: The challenges of integrating graphene into existing packages Dr. Ali Murad, Test & Packaging Engineer. Paragraf
9:45am - 10:45am	S 5A: Sintering I Location: Main Conference Room Chair: Martin Wickham, National Physical Laboratory	S 5B: Equipment / Inspection Location: Rosalind Franklin Pavilion Chair: Jeff Kettle, UoGlasgow
10:45am - 11:15am	Break - Exhibition
11:15am - 12:35pm	S 6A: Photonics and Optics Location: Main Conference Room Chair: Jayakrishnan Chandrappan, CSA Catapult	S 6B: Solder / Soldering Location: Rosalind Franklin Pavilion Chair: Attila Géczy, Budapest University of Technology and Economics
12:35pm - 1:40pm	Lunch - Exhibition
1:40pm - 2:10pm	Keynote 4: Advanced Packaging - Challenges that are driving new package innovation & ecosystem needs Mark Gerber, Sr. Director Engineering and Technical Marketing, ASE Group
2:15pm - 3:15pm	S 7A: Sintering II Location: Main Conference Room Chair: Andy Longford, PandA Europe	S 7B: Hermetic/Conformal Coatings/Thermal Interface Materials Location: Rosalind Franklin Pavilion Chair: Hassan Akhtar, Manufacturing Technology Centre
3:15pm - 3:45pm	Break - Exhibition
3:45pm - 5:05pm	S 8A: Flip Chip Location: Main Conference Room Chair: John Lipp, IMAPS-UK	S 8B: Reliability and Sustainability Location: Rosalind Franklin Pavilion Chair: Derek Braden, Aptiv
7:00pm - 10:00pm	Dinner at Homerton

Date: Thursday, 14/Sept/2023
8:30am - 9:00am	Exhibition
9:00am - 9:30am	Keynote 5: Reinventing Electronics for a Sustainable World Dr. Feras Alkhalil, Principal Scientist and Director of R&D, Pragmatic Semiconductor
9:35am - 10:35am	S 9A: Machine Learning Location: Main Conference Room Chair: Stephen Riches, IMAPS-UK (International Microelctronics Assembly and Packaging Society - UK Chapter	S 9B: Solar / Sensors Location: Rosalind Franklin Pavilion Chair: Knut E Aasmundtveit, University of South-Eastern Norway
10:35am - 11:10am	Break - Exhibition
11:10am - 12:30pm	S 10A: High Frequency Location: Main Conference Room Chair: Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology (BTU) Cottbus-Senftenberg	S 10B: Power Modules Location: Rosalind Franklin Pavilion Chair: Andy Longford, PandA Europe
12:30pm - 1:00pm	Closing session - Awards - Advance information on ESTC 2024 and EMPC 2025
1:00pm - 2:00pm	Light Lunch & Exhibition