Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 11/Sept/2023 | ||
| 8:30am - 6:00pm |
Pre-Registration |
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| 9:00am - 1:00pm |
SC 1: Evolution of Die Attach Adhesives & Encapsulants used in Semi-Conductor Packaging Course instructor: Tony Winster, Henkel Ltd. more info |
SC 2: Fan-out, Chiplet Design, and Heterogeneous Integration Packaging Course instructor: John H. Lau, Unimicron Technology Corporation more info |
| 1:30pm - 5:30pm |
SC 3: Power Electronics Packaging – Understanding the Packaging Processes Course instructor: Andy Longford, PandA Europe more info |
SC 4: From Wafer to Panel Level Packaging Course instructors: Tanja Braun, Fraunhofer IZM | Markus Wöhrmann, Fraunhofer IZM more info |
| Date: Tuesday, 12/Sept/2023 | ||
| 8:30am - 9:00am |
Registration/Exhibition |
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| 8:55am - 9:10am |
Welcome & Conference Opening |
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| 9:10am - 9:40am |
Keynote 1 |
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| 9:45am - 10:45am |
S 1 A: Interconnect Material I |
S 1 B: Embedding |
| 10:45am - 11:15am |
Break - Exhibition |
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| 11:15am - 12:35pm |
S 2 A: Interconnect Materials II |
S 2 B: MEMS/Sensors |
| 12:35pm - 1:40pm |
Lunch - Exhibition |
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| 1:40pm - 2:10pm |
Keynote 2 |
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| 2:15pm - 3:15pm |
S 3 A: Substrates: Thick Film and Other |
S 3 B: Adhesives and Encapsulants |
| 3:15pm - 3:45pm |
Break - Exhibition |
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| 3:45pm - 5:05pm |
S 4 A: Substrates: LTCC and HTCC |
S 4 B: Equipment / Inspection |
| 5:10pm - 7:00pm |
Exhibition, Poster, Pizza |
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| Date: Wednesday, 13/Sept/2023 | ||
| 8:30am - 9:00am |
Exhibition |
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| 9:00am - 9:10am |
Welcome: Day 2 |
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| 9:10am - 9:40am |
Keynote 3 |
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| 9:45am - 10:45am |
S 5 A: Sintering I |
S 5 B: Medical |
| 10:45am - 11:15am |
Break - Exhibition |
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| 11:15am - 12:35pm |
S 6 A: Solder / Soldering |
S 6 B: Photonics and Optics |
| 12:35pm - 1:40pm |
Lunch - Exhibition |
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| 1:40pm - 2:10pm |
Keynote 4 |
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| 2:15pm - 3:15pm |
S 7 A: Sintering II |
S 7 B: Hermetic/Conformal Coatings/Thermal Interface Materials |
| 3:15pm - 3:45pm |
Break - Exhibition |
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| 3:45pm - 5:05pm |
S 8 A: Flip Chip |
S 8 B: Reliability and Sustainability |
| 7:00pm - 10:00pm |
Dinner at Homerton |
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| Date: Thursday, 14/Sept/2023 | ||
| 8:30am - 9:00am |
Exhibition |
|
| 9:00am - 9:30am |
Keynote 5 |
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| 9:35am - 10:35am |
S 9 A: Solar / Sensors |
S 9 B: Machine Learning |
| 10:35am - 11:10am |
Break - Exhibition |
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| 11:10am - 12:30pm |
S 10 A: High Frequency |
S 10 B: Power Modules |
| 12:30pm - 1:00pm |
Closing session - Awards - Advance information on ESTC 2024 and EMPC 2025 |
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| 1:00pm - 2:00pm |
Light Lunch & Exhibition |
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