Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
| Date: Monday, 11/Sept/2023 | ||
| 8:30am - 6:00pm |
Pre-Registration |
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| 9:00am - 1:00pm |
SC 1: Evolution of Die Attach Adhesives & Encapsulants used in Semi-Conductor Packaging Location: Green Room Course instructor: Tony Winster, Henkel Ltd. more info |
SC 2: Fan-out, Chiplet Design, and Heterogeneous Integration Packaging Location: Library Course instructor: John H. Lau, Unimicron Technology Corporation more info |
| 1:30pm - 5:30pm |
SC 3: Power Electronics Packaging – Understanding the Packaging Processes Location: Green Room Course instructor: Andy Longford, PandA Europe more info |
SC 4: From Wafer to Panel Level Packaging Location: Library Course instructors: Tanja Braun, Fraunhofer IZM | Markus Wöhrmann, Fraunhofer IZM more info |
| 6:00pm - 7:30pm |
Welcome Reception at Homerton College |
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| Date: Tuesday, 12/Sept/2023 | ||
| 8:30am - 9:00am |
Registration/Exhibition |
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| 8:55am - 9:10am |
Welcome & Conference Opening Chair: Anne Vanhoestenberghe, King's College London |
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| 9:10am - 9:40am |
Keynote 1: Interconnecting Chiplets |
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| 9:45am - 10:45am |
S 1A: Substrates: LTCC and HTCC Location: Main Conference Room Chair: Peter Barnwell, IMAPS-UK Trustee |
S 1B: Embedding Location: Rosalind Franklin Pavilion Chair: Viorel Nicolau, "Dunarea de Jos" University of Galati |
| 10:45am - 11:15am |
Break - Exhibition |
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| 11:15am - 12:35pm |
S 2A: Interconnect Materials I Location: Main Conference Room Chair: Rolf Aschenbrenner, Fraunhofer IZM |
S 2B: MEMS/Sensors Location: Rosalind Franklin Pavilion Chair: Andrew Holland, RF Module And Optical Design Limited |
| 12:35pm - 1:40pm |
Lunch - Exhibition |
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| 1:40pm - 2:10pm |
Keynote 2: Wide Bandgap Devices and Multi-dimensional Architectures in the New Era of Power Electronics |
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| 2:15pm - 3:15pm |
S 3A: Substrates – Thick Film and Cu Interconnects Location: Main Conference Room Chair: Jens Müller, Technische Universität Ilmenau |
S 3B: Adhesives and Encapsulants Location: Rosalind Franklin Pavilion Chair: Eamonn Redmond, Inseto (UK) Ltd |
| 3:15pm - 3:45pm |
Break - Exhibition |
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| 3:45pm - 5:05pm |
S 4A: Interconnect Material II Location: Main Conference Room Chair: Olivér Krammer, Budapest University of Technology and Economics |
S 4B: Medical Location: Rosalind Franklin Pavilion Chair: Anne Vanhoestenberghe, King's College London |
| 5:10pm - 7:00pm |
P: Exhibition, Poster, Pizza |
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| Date: Wednesday, 13/Sept/2023 | ||
| 8:30am - 9:00am |
Exhibition |
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| 9:00am - 9:10am |
Welcome: Day 2 |
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| 9:10am - 9:40am |
Keynote 3: The challenges of integrating graphene into existing packages |
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| 9:45am - 10:45am |
S 5A: Sintering I Location: Main Conference Room Chair: Martin Wickham, National Physical Laboratory |
S 5B: Equipment / Inspection Location: Rosalind Franklin Pavilion Chair: Jeff Kettle, UoGlasgow |
| 10:45am - 11:15am |
Break - Exhibition |
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| 11:15am - 12:35pm |
S 6A: Photonics and Optics Location: Main Conference Room Chair: Jayakrishnan Chandrappan, CSA Catapult |
S 6B: Solder / Soldering Location: Rosalind Franklin Pavilion Chair: Attila Géczy, Budapest University of Technology and Economics |
| 12:35pm - 1:40pm |
Lunch - Exhibition |
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| 1:40pm - 2:10pm |
Keynote 4: Advanced Packaging - Challenges that are driving new package innovation & ecosystem needs |
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| 2:15pm - 3:15pm |
S 7A: Sintering II Location: Main Conference Room Chair: Andy Longford, PandA Europe |
S 7B: Hermetic/Conformal Coatings/Thermal Interface Materials Location: Rosalind Franklin Pavilion Chair: Hassan Akhtar, Manufacturing Technology Centre |
| 3:15pm - 3:45pm |
Break - Exhibition |
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| 3:45pm - 5:05pm |
S 8A: Flip Chip Location: Main Conference Room Chair: John Lipp, IMAPS-UK |
S 8B: Reliability and Sustainability Location: Rosalind Franklin Pavilion Chair: Derek Braden, Aptiv |
| 7:00pm - 10:00pm |
Dinner at Homerton |
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| Date: Thursday, 14/Sept/2023 | ||
| 8:30am - 9:00am |
Exhibition |
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| 9:00am - 9:30am |
Keynote 5: Reinventing Electronics for a Sustainable World |
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| 9:35am - 10:35am |
S 9A: Machine Learning Location: Main Conference Room Chair: Stephen Riches, IMAPS-UK (International Microelctronics Assembly and Packaging Society - UK Chapter |
S 9B: Solar / Sensors Location: Rosalind Franklin Pavilion Chair: Knut E Aasmundtveit, University of South-Eastern Norway |
| 10:35am - 11:10am |
Break - Exhibition |
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| 11:10am - 12:30pm |
S 10A: High Frequency Location: Main Conference Room Chair: Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology (BTU) Cottbus-Senftenberg |
S 10B: Power Modules Location: Rosalind Franklin Pavilion Chair: Andy Longford, PandA Europe |
| 12:30pm - 1:00pm |
Closing session - Awards - Advance information on ESTC 2024 and EMPC 2025 |
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| 1:00pm - 2:00pm |
Light Lunch & Exhibition |
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