Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Monday, 11/Sept/2023
8:30am
-
6:00pm
Pre-Registration
9:00am
-
1:00pm
SC 1: Evolution of Die Attach Adhesives & Encapsulants used in Semi-Conductor Packaging

Course instructor: Tony Winster, Henkel Ltd.

more info
SC 2: Fan-out, Chiplet Design, and Heterogeneous Integration Packaging

Course instructor: John H. Lau, Unimicron Technology Corporation

more info
1:30pm
-
5:30pm
SC 3: Power Electronics Packaging – Understanding the Packaging Processes

Course instructor: Andy Longford, PandA Europe

more info
SC 4: From Wafer to Panel Level Packaging

Course instructors: Tanja Braun, Fraunhofer IZM | Markus Wöhrmann, Fraunhofer IZM

more info

Date: Tuesday, 12/Sept/2023
8:30am
-
9:00am
Registration/Exhibition
8:55am
-
9:10am
Welcome & Conference Opening
9:10am
-
9:40am
Keynote 1
9:45am
-
10:45am
S 1 A: Interconnect Material I
S 1 B: Embedding
10:45am
-
11:15am
Break - Exhibition
11:15am
-
12:35pm
S 2 A: Interconnect Materials II
S 2 B: MEMS/Sensors
12:35pm
-
1:40pm
Lunch - Exhibition
1:40pm
-
2:10pm
Keynote 2
2:15pm
-
3:15pm
S 3 A: Substrates: Thick Film and Other
S 3 B: Adhesives and Encapsulants
3:15pm
-
3:45pm
Break - Exhibition
3:45pm
-
5:05pm
S 4 A: Substrates: LTCC and HTCC
S 4 B: Equipment / Inspection
5:10pm
-
7:00pm
Exhibition, Poster, Pizza

Date: Wednesday, 13/Sept/2023
8:30am
-
9:00am
Exhibition
9:00am
-
9:10am
Welcome: Day 2
9:10am
-
9:40am
Keynote 3
9:45am
-
10:45am
S 5 A: Sintering I
S 5 B: Medical
10:45am
-
11:15am
Break - Exhibition
11:15am
-
12:35pm
S 6 A: Solder / Soldering
S 6 B: Photonics and Optics
12:35pm
-
1:40pm
Lunch - Exhibition
1:40pm
-
2:10pm
Keynote 4
2:15pm
-
3:15pm
S 7 A: Sintering II
S 7 B: Hermetic/Conformal Coatings/Thermal Interface Materials
3:15pm
-
3:45pm
Break - Exhibition
3:45pm
-
5:05pm
S 8 A: Flip Chip
S 8 B: Reliability and Sustainability
7:00pm
-
10:00pm
Dinner at Homerton

Date: Thursday, 14/Sept/2023
8:30am
-
9:00am
Exhibition
9:00am
-
9:30am
Keynote 5
9:35am
-
10:35am
S 9 A: Solar / Sensors
S 9 B: Machine Learning
10:35am
-
11:10am
Break - Exhibition
11:10am
-
12:30pm
S 10 A: High Frequency
S 10 B: Power Modules
12:30pm
-
1:00pm
Closing session - Awards - Advance information on ESTC 2024 and EMPC 2025
1:00pm
-
2:00pm
Light Lunch & Exhibition