Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Monday, 11/Sept/2023
8:30am
-
6:00pm
Pre-Registration
9:00am
-
1:00pm
SC 1: Evolution of Die Attach Adhesives & Encapsulants used in Semi-Conductor Packaging
Location: Green Room

Course instructor: Tony Winster, Henkel Ltd.

more info
SC 2: Fan-out, Chiplet Design, and Heterogeneous Integration Packaging
Location: Library

Course instructor: John H. Lau, Unimicron Technology Corporation

more info
1:30pm
-
5:30pm
SC 3: Power Electronics Packaging – Understanding the Packaging Processes
Location: Green Room

Course instructor: Andy Longford, PandA Europe

more info
SC 4: From Wafer to Panel Level Packaging
Location: Library

Course instructors: Tanja Braun, Fraunhofer IZM | Markus Wöhrmann, Fraunhofer IZM

more info
6:00pm
-
7:30pm
Welcome Reception at Homerton College

Date: Tuesday, 12/Sept/2023
8:30am
-
9:00am
Registration/Exhibition
8:55am
-
9:10am
Welcome & Conference Opening
Chair: Anne Vanhoestenberghe, King's College London
9:10am
-
9:40am
Keynote 1: Interconnecting Chiplets
9:45am
-
10:45am
S 1A: Substrates: LTCC and HTCC
Location: Main Conference Room
Chair: Peter Barnwell, IMAPS-UK Trustee
S 1B: Embedding
Location: Rosalind Franklin Pavilion
Chair: Viorel Nicolau, "Dunarea de Jos" University of Galati
10:45am
-
11:15am
Break - Exhibition
11:15am
-
12:35pm
S 2A: Interconnect Materials I
Location: Main Conference Room
Chair: Rolf Aschenbrenner, Fraunhofer IZM
S 2B: MEMS/Sensors
Location: Rosalind Franklin Pavilion
Chair: Andrew Holland, RF Module And Optical Design Limited
12:35pm
-
1:40pm
Lunch - Exhibition
1:40pm
-
2:10pm
Keynote 2: Wide Bandgap Devices and Multi-dimensional Architectures in the New Era of Power Electronics
2:15pm
-
3:15pm
S 3A: Substrates – Thick Film and Cu Interconnects
Location: Main Conference Room
Chair: Jens Müller, Technische Universität Ilmenau
S 3B: Adhesives and Encapsulants
Location: Rosalind Franklin Pavilion
Chair: Eamonn Redmond, Inseto (UK) Ltd
3:15pm
-
3:45pm
Break - Exhibition
3:45pm
-
5:05pm
S 4A: Interconnect Material II
Location: Main Conference Room
Chair: Olivér Krammer, Budapest University of Technology and Economics
S 4B: Medical
Location: Rosalind Franklin Pavilion
Chair: Anne Vanhoestenberghe, King's College London
5:10pm
-
7:00pm
P: Exhibition, Poster, Pizza

Date: Wednesday, 13/Sept/2023
8:30am
-
9:00am
Exhibition
9:00am
-
9:10am
Welcome: Day 2
9:10am
-
9:40am
Keynote 3: The challenges of integrating graphene into existing packages
9:45am
-
10:45am
S 5A: Sintering I
Location: Main Conference Room
Chair: Martin Wickham, National Physical Laboratory
S 5B: Equipment / Inspection
Location: Rosalind Franklin Pavilion
Chair: Jeff Kettle, UoGlasgow
10:45am
-
11:15am
Break - Exhibition
11:15am
-
12:35pm
S 6A: Photonics and Optics
Location: Main Conference Room
Chair: Jayakrishnan Chandrappan, CSA Catapult
S 6B: Solder / Soldering
Location: Rosalind Franklin Pavilion
Chair: Attila Géczy, Budapest University of Technology and Economics
12:35pm
-
1:40pm
Lunch - Exhibition
1:40pm
-
2:10pm
Keynote 4: Advanced Packaging - Challenges that are driving new package innovation & ecosystem needs
2:15pm
-
3:15pm
S 7A: Sintering II
Location: Main Conference Room
Chair: Andy Longford, PandA Europe
S 7B: Hermetic/Conformal Coatings/Thermal Interface Materials
Location: Rosalind Franklin Pavilion
Chair: Hassan Akhtar, Manufacturing Technology Centre
3:15pm
-
3:45pm
Break - Exhibition
3:45pm
-
5:05pm
S 8A: Flip Chip
Location: Main Conference Room
Chair: John Lipp, IMAPS-UK
S 8B: Reliability and Sustainability
Location: Rosalind Franklin Pavilion
Chair: Derek Braden, Aptiv
7:00pm
-
10:00pm
Dinner at Homerton

Date: Thursday, 14/Sept/2023
8:30am
-
9:00am
Exhibition
9:00am
-
9:30am
Keynote 5: Reinventing Electronics for a Sustainable World
9:35am
-
10:35am
S 9A: Machine Learning
Location: Main Conference Room
Chair: Stephen Riches, IMAPS-UK (International Microelctronics Assembly and Packaging Society - UK Chapter
S 9B: Solar / Sensors
Location: Rosalind Franklin Pavilion
Chair: Knut E Aasmundtveit, University of South-Eastern Norway
10:35am
-
11:10am
Break - Exhibition
11:10am
-
12:30pm
S 10A: High Frequency
Location: Main Conference Room
Chair: Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology (BTU) Cottbus-Senftenberg
S 10B: Power Modules
Location: Rosalind Franklin Pavilion
Chair: Andy Longford, PandA Europe
12:30pm
-
1:00pm
Closing session - Awards - Advance information on ESTC 2024 and EMPC 2025
1:00pm
-
2:00pm
Light Lunch & Exhibition