Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 29th June 2025, 01:31:30am CEST
AI Application for Electromagnetic Compatibility Analysis in Aeronautical Systems
Pierre Amblard1, Adil El Abbazi2
1Thales; 2Thales
With the rapid advancements in artificial intelligence (AI), electromagnetic compatibility (EMC) engineering is evolving. Thanks to AI, engineers will be able to perform advanced, data-driven analysis of electromagnetic phenomena, helping them make smarter decisions early in the design process. By using data from simulations, test reports, and existing design rules, AI will find different patterns, predict problems, and suggest design improvements before building physical prototypes. These capabilities will help reduce development time, simplify compliance, and lead to more reliable systems in the aeronautical industry.
4:50pm - 5:20pm
Optimization of High-Speed Links in Aeronautical Systems
Soazig Le Bihan1, Adil El Abbazi2
1Thales; 2Thales
Advancements in Printed Circuit Board (PCB) technologies have significantly improved circuit density and engraving precision, enabling faster data rates, higher clock speeds, and lower power consumption in limited spaces. Signal integrity (SI) is a key factor in PCB design, as issues like signal attenuation, impedance mismatching, crosstalk, and jitter can degrade signal quality. High-speed designs require careful optimization of any impedance discontinuities to prevent signal reflections and losses. These structures must be optimized to balance manufacturing constraints, cost, and performance, especially in avionics systems. New design changes impact previous optimizations, requiring the development of flexible and adaptive models. Signal attenuation due to dielectric and conductive losses also requires precise modeling, considering PCB properties and frequency-dependent effects. A measurement approach, focusing on de-embedding methods and material characterization, enhances simulation accuracy and reduces reliance on costly test vehicles, supporting the aeronautical industry’s need for reliable, cost-effective solutions.
5:20pm - 5:50pm
Electromagnetic Simulation in IoT Embedded System
Erica Burzi
SECO spa
The Secure Digital Input Output (SDIO) interface is essential in embedded systems, facilitating high-speed data transmission. However, as operating frequencies increase, electromagnetic interference (EMI) becomes a significant challenge, potentially impacting regulatory compliance and overall system performance. This analysis utilizes ANSYS simulation tools to analyze the EMI characteristics of SDIO signals, leveraging electromagnetic models such as IBIS and time-frequency domain analysis techniques. The objective is to identify emission mechanisms and assess mitigation strategies, including filtering, shielding, and PCB layout optimization
