Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Please note that all times are shown in the time zone of the conference. The current conference time is: 29th June 2025, 02:18:28am CEST
Challenges in the EMC Characterization of a CIS Camera Module for Medical and Consumer Applications
Patrick Wiesenhofer1, Dominik Kreindl1,2, Bernhard Weiss1, Thomas Bauernfeind2, Christian Stockreiter1
1ams OSRAM AG, Austria; 2Institute of Fundamentals and Theory in Electrical Engineering, Graz University of Technology, Austria
This technical paper presents a new methodology for the full integrated circuit (IC) level electromagnetic compatibility (EMC) characterization of a complementary metal-oxide semiconductor (CMOS) image sensors (CIS) camera IC developed for both medical endoscopy and consumer applications. The focus is on the challenges encountered in the necessary hardware and software development required for effective EMC characterization. Key challenges include designing a printed circuit board (PCB) suitable for all required tests, including accurate high-frequency simulation models, finding a failure criterion (FC) suited for camera sensors, and ensuring compliance with international EMC standards.
EMC Analysis and Estimation Method in IoT Embedded System
Erica Burzi1, Antea Perrotta2, Laura Fabbri1, Alessandro Pali1
1Seco Spa, Italy; 2ANSYS Corp, Italy
Currently, Wi-Fi (Wireless Fidelity) and Bluetooth are essential for communication in everyday life. In the context of the IoT (Internet of Things) the most commonly communication technology is this type of technology. We designed a Printed Circuit Board (PCB) with two Wi-Fi antennas and used filter to also tune one of them for Bluetooth. This structure has been placed inside a system that represent the mechanical part of the device. The complete complex system has been simulated by using ANSYS HFSS v.25R1.
The use of far-field data is very promising to study the interaction of multiple devices. Estimating the field emission of PCBs early in the development process helps to ensure compliance with limit values in final antenna measurements, to initiate necessary redesign processes, and to keep costs low. The results obtained demonstrating that established simulation model is suitable for predicting electromagnetic characteristics of a dual-band Wi-Fi and Bluetooth antenna. This is useful for optimizing the design and reducing the prototype cost during the design process.
Investigation on the Susceptibility to RFI of High-Voltage Current Sensors
Franco Fiori
Politecnico di Torino, Italy
Current sensors inserted in the cables connecting electric drives to power loads are likely exposed to the radio frequency interference (RFI) collected by cables, which behave like unintended antennas. This paper investigates the susceptibility to the RFI of such components referring to the bulk current injection (BCI) test method, which is used at the module level, and to the direct power injection (DPI) test, which applies at the component level. A method to evaluate the RF power level to be applied in the DPI test at the inputs of a current sensor to allow an electronic module comprising that device to pass the BCI test is proposed.
A Combined Common Mode Choke and Transformer Component for Enhanced Miniaturization and Performance
Jianquan Lou1, Alpesh Bhobe2, Haiwen Lu1
1Cisco System (China) R&D Co. Ltd.; 2Cisco Systems, Inc.
As product miniaturization and densification become critical in modern electronics, integrating separate components into unified structures is a viable solution. This paper introduces a novel combined component that integrates a common mode choke and a transformer, addressing challenges in space and material efficiency without compromising performance. Detailed structural design, operational principles, and performance comparisons are discussed, demonstrating the advantages of this innovative approach.
