Conference Time: 25th Aug 2025, 12:22:56am CEST
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Semiconductors, PCB and Packaging (Part 2)
Time:
Thursday, 04/Sept/2025:
9:00am - 10:30am
Session Chair: Prof. Franco Fiori , Politecnico di Torino, ItalySession Chair: Prof. Richard Perdriau , ESEO, France
Location: Room 105 75 seats, Tower 44, 1st floor
Presentations
Challenges in the EMC Characterization of a CIS Camera Module for Medical and Consumer Applications
Patrick Wiesenhofer1 , Dominik Kreindl 1,2 , Bernhard Weiss1 , Thomas Bauernfeind2 , Christian Stockreiter1
1 ams OSRAM AG, Austria; 2 Institute of Fundamentals and Theory in Electrical Engineering, Graz University of Technology, Austria
EMC Analysis and Estimation Method in IoT Embedded System
Erica Burzi 1 , Antea Perrotta2 , Laura Fabbri1 , Alessandro Pali1
1 Seco Spa, Italy; 2 ANSYS Corp, Italy
Investigation on the Susceptibility to RFI of High-Voltage Current Sensors
Franco Fiori
Politecnico di Torino, Italy
A Combined Common Mode Choke and Transformer Component for Enhanced Miniaturization and Performance
Jianquan Lou 1 , Alpesh Bhobe2 , Haiwen Lu1
1 Cisco System (China) R&D Co. Ltd.; 2 Cisco Systems, Inc.
