Session  
W_Mo_C_Room2: Signal & Power Integrity, EMI/EMC for PCB Design with ANSYS tools (I)
 
Session Abstract  
In this workshop, the typical Power and Signal integrity EMI/EMC issues on PCBs will be solved by a Full wave hybrid simulation approach coupled with the help of an advanced circuit simulator for the nonlinear time transient analysis. The PCB scattering parameter extraction provided by our full wave hybrid numerical code helps to identify issues on Power Delivery Network (PDN) and run a design of experiment genetic algorithm which can find the right decoupling capacitor strategy based on PDN noise and capacitor number minimization. Examples of this technique will be presented in this workshop. The circuit simulator, with the PCB scattering parameter to steadystate space model conversion though advanced mathematical models, is used to build a full nonlinear transient simulation to evaluate eye diagrams, voltage/currents transient diagrams and all the quantities useful for solving Signal Integrity issues, importing IBIS and Spice models for active devices in our environment. The time domain currents can be transformed in the frequency domain by a Fast Fourier Transform (FFT) and these can be analysed as a direct output for conductive emission problems, connecting circuit models for the Linear Impedance Stabilization Network (LISN). Examples of signal integrity and EMI/EMC will be presented in real cases. The PCB and Circuit coupling are even important for evaluating the EMI/EMC issues. The Steadystate model is dynamically linked with the PCB project and the time domain current can be pushed back to the PCB as FFT to calculate the Near and Farfield by integrating the currents on the PCB. This helps designers to predict EMI/EMC issues and discover critical areas on the PCB. Moreover, a novel Multiphysics approach has been developed to consider DCBias and temperature for the PCB capacitors. A DC solver can be used to evaluate the DC current and voltage distribution on the PCB and discover if there are traces or bias with a high current density, and at the same time, to evaluate the DCBias condition. The capacitor models have a DCBias and temperature dependence which can be automatically read by our internal code and the PCB can be simulated in the operative conditions which can have a significant impact on the EMI/EMC results in some cases. Examples of this new technique and the Multiphysics approach will be shown in the workshop.
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